Movie 1

Sectioning and on-wafer transfer of the arrays using the modified diamond knife with the modified basin. There are several key steps in this procedure:
1. Sectioning. The time required for sectioning depends on the desired number of sections and the speed of sectioning. We used a rate of 0.8-1.0 μm/sec.
2. Alignment of ribbons of consecutive sections. During the first step, one or several ribbons can be generated. Multiple ribbons can be arranged side by side using gentle movements of an eyelash attached to a thin stick.
3. Water draining. Water retraction can be achieved by active aspiration through the syringe and by passive dripping through the plastic catheter. The entire procedure takes a couple of minutes at the most.
4. Readjustment of ribbons. While draining the water from the basin, the aligned ribbons often become misaligned. While water remains on the surface of the wafer, we can readjust the ribbons until the surface starts to dry.
5. Gradual evaporation of water from the surface of the wafer. We consider this step to be critical to avoid folds in the sections. The visual zoom-in on a drying portion of the ribbon illustrates this concept well. The length of time for drying will largely depend on the size of the surface area and the surrounding environmental conditions. In practice, drying takes 10 to 30 minutes for a wafer of 2x4 cm.